Electronic Thermal Management

Our electronic thermal management research focused on developing innovative cooling solutions for high-power density electronic components. The project involved comprehensive thermal characterization and optimization of cooling strategies for next-generation semiconductor devices and power electronics. We employed advanced numerical modeling techniques to analyze thermal transport at multiple scales, from device-level heat generation to system-level heat dissipation. The research included detailed investigation of thermal interface materials, micro-channel cooling designs, and phase-change cooling mechanisms. Key Technical Achievements: • Developed multi-physics models coupling electrical and thermal phenomena • Optimized micro-channel geometries for enhanced cooling performance • Achieved junction temperature reduction of 35°C under peak loads • Implemented novel phase-change material integration • Reduced thermal resistance by 45% at critical interfaces

The research findings have been particularly impactful in high-performance computing applications, enabling higher power densities while maintaining reliable operation.